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北美电子包装材料Market

  • Report Code: EL 1000
  • Publish Date: Upcoming
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北美电子包装材料Market

半导体和IC包装材料在电子包装材料行业中发挥着重要作用,因为这些产品增强了电子元件的安全和保护。2013年北美电子包装材料市场的价值为2935.86亿美元,预计2019年将达到3,367.02百万美元,从2014年增长3.2%。包装材料的需求主要由最终用户行业的需求驱动增加对移动和计算应用的需求。

电子包装材料用于提供防腐蚀,外部冲击的保护,并且还可以保持用于从外部电路连接到半导体和IC的装置的接触引脚或导线。

北美半导体和IC包装材料市场一直在目睹了稳定增长,因为该国家将其作为半导体制造的尖端开发领域的领导者保持着。通过全球消费电子产品的最高消费之一,美国市场对电子包装材料具有巨大的需求和生产能力。然而,随着最近转向低成本亚洲国家的转变,美国市场逐渐失去其优势

The key countries covered in North America Electronic Packaging Material Market are Canada and U.S. The various applications studied include semiconductors and ICs. The different types studied in North America Electronic Packaging Material market include organic substrates, ceramic packages, leadframes, die attach materials, encapsulation resins, and others. Different types of packaging technology such as SOP, GA, QFN, DFN QFP, DIP, and others are also studied in the North America Electronic Packaging Material market. Further, as a part of qualitative analysis, the North America Electronic Packaging Material Market research report provides a comprehensive review of the important drivers, restraints, opportunities, and burning issues in the North America Electronic Packaging Material market.

北美电子包装材料市场报告还提供了广泛的竞争态势,在该市场中运营的公司。它还包括各种市场参与者采用的公司简介,包括巴斯夫,日立化工有限公司和宏伟的PLC等。

定制选项:

通过市场数据,您还可以自定义满足您公司特定需求的MMM评估。定制以获得全面的行业标准和深度潜水分析以下参数:

  • Competitive landscape with a detailed comparison of portfolio of each company mapped at the regional and country-level
  • 详细分析各公司采用的新产品发布,扩展,合并和收购等竞争策略及其对北美电子包装材料市场的影响
  • Scale analysis that comprises comparison with Global Electronics Packaging Material Market
  • 正在考虑的市场的燃烧问题,机会和信息
  • SWOT analysis prior to the top companies of North America Electronic Packaging Material Market
  • 搬运工的五部队分析分析和确定市场情况以及正在考虑的市场的长期盈利能力



1 Introduction
1.1 Objective of the study
1.2 Market Definitions
1.3 Market Segmentation & Aspects Covered
1.4研究方法
1.4.1假设(市场规模,预测等)万博手机版下载
2执行摘要
3 Market Overview
4 Electronic Packaging Material-North America, By Applications
4.1通过地理分开
4.1电子包装材料 - 美国。通过应用程序
4.1 Electronic Packaging Material-Canada by Applications
4.1 Electronic Packaging Material-Mexico by Applications
4.2 Electronic Packaging Material-North America-Small Outline Package (SOP)
4.2.1电子包装材料 - 北美 - 小型套餐(SOP),由地理位置
4.2.1.1 Electronic Packaging Material-U.S.-Small Outline Package (SOP)
4.2.1.2 Electronic Packaging Material-Canada-Small Outline Package (SOP)
4.2.1.3 Electronic Packaging Material-Mexico-Small Outline Package (SOP)
4.3电子包装材料 - 北美 - 网格阵列(GA)
4.3.1 Electronic Packaging Material-North America-Grid Array (GA), By Geographies
4.3.1.1 Electronic Packaging Material-U.S.-Grid Array (GA)
4.3.1.2 Electronic Packaging Material-Canada-Grid Array (GA)
4.3.1.3电子包装材料 - 墨西哥网格阵列(GA)
4.4 Electronic Packaging Material-North America-Quad Flat No-leads package (QFN)
4.4.1电子包装材料 - 北美 - 四边形无铅套餐(QFN),由地理位置
4.4.1.1电子包装材料 - U.S.-四扁平无铅包装(QFN)
4.4.1.2电子包装材料 - 加拿大 - 四边形无铅包装(QFN)
4.4.1.3电子包装材料 - 墨西哥 - 四扁平无铅包装(QFN)
4.5 Electronic Packaging Material-North America-Dual Flat No Lead Package (DFN)
4.5.1电子包装材料 - 北美 - 双平没有铅包包(DFN),由地理位置
4.5.1.1 Electronic Packaging Material-U.S.-Dual Flat No Lead Package (DFN)
4.5.1.2 Electronic Packaging Material-Canada-Dual Flat No Lead Package (DFN)
4.5.1.3电子包装材料 - 墨西哥双平没有铅包包(DFN)
4.6 Electronic Packaging Material-North America-Quad Flat Package (QFP)
4.6.1 Electronic Packaging Material-North America-Quad Flat Package (QFP), By Geographies
4.6.1.1电子包装材料 - U.S.-四平包装(QFP)
4.6.1.2 Electronic Packaging Material-Canada-Quad Flat Package (QFP)
4.6.1.3电子包装材料 - 墨西哥四扁包装(QFP)
4.7电子包装材料 - 北美 - 双线封装(浸)
4.7.1电子包装材料 - 北美 - 双线封装(DIP),由地理位置
4.7.1.1电子包装材料 - U.S.-Dual在线包装(DIP)
4.7.1.2 Electronic Packaging Material-Canada-Dual in-line package (DIP)
4.7.1.3 Electronic Packaging Material-Mexico-Dual in-line package (DIP)
5 Electronic Packaging Material-North America, By Types
5.1通过地理分开
5.2 Electronic Packaging Material-U.S. by Types
5.1 Electronic Packaging Material-Canada by Types
5.1电子包装材料 - 墨西哥类型
5.2 Electronic Packaging Material-Organic Substrates-North America
5.2.1 Electronic Packaging Material-Organic Substrates-North America, By Geographies
5.2.1.1电子包装材料 - 有机基材-U.S。
5.2.1.2电子包装材料 - 有机基材 - 加拿大
5.2.1.3 Electronic Packaging Material-Organic Substrates-Mexico
5.3 Electronic Packaging Material-Bonding Wires-North America
5.3.1 Electronic Packaging Material-Bonding Wires-North America, By Geographies
5.3.1.1 Electronic Packaging Material-Bonding Wires-U.S.
5.3.1.2电子包装材料粘合线 - 加拿大
5.3.1.3电子包装材料粘合线 - 墨西哥
5.4埃尔ectronic Packaging Material-Lead Frames-North America
5.4.1 Electronic Packaging Material-Lead Frames-North America, By Geographies
5.4.1.1 Electronic Packaging Material-Lead Frames-U.S.
5.4.1.2电子包装材料 - 引线框架 - 加拿大
5.4.1.3电子包装材料 - 引线框架 - 墨西哥
5.5电子包装材料 - 封装树脂 - 北美
5.5.1 Electronic Packaging Material-Encapsulation Resins-North America, By Geographies
5.5.1.1电子包装材料 - 封装树脂-U.S。
5.5.1.2 Electronic Packaging Material-Encapsulation Resins-Canada
5.5.1.3 Electronic Packaging Material-Encapsulation Resins-Mexico
5.6电子包装材料 - 陶瓷包装 - 北美
5.6.1 Electronic Packaging Material-Ceramic Packages-North America, By Geographies
5.6.1.1 Electronic Packaging Material-Ceramic Packages-U.S.
5.6.1.2电子包装材料 - 陶瓷包装 - 加拿大
5.6.1.3电子包装材料 - 陶瓷包装 - 墨西哥
5.7 Electronic Packaging Material-Die Attach Materials-North America
5.7.1 Electronic Packaging Material-Die Attach Materials-North America, By Geographies
5.7.1.1电子包装材料模具附着材料 - U.S。
5.7.1.2 Electronic Packaging Material-Die Attach Materials-Canada
5.7.1.3电子包装材料 - 模具安装材料 - 墨西哥
5.8 Electronic Packaging Material-Thermal Interface Materials-North America
5.8.1 Electronic Packaging Material-Thermal Interface Materials-North America, By Geographies
5.8.1.1 Electronic Packaging Material-Thermal Interface Materials-U.S.
5.8.1.2 Electronic Packaging Material-Thermal Interface Materials-Canada
5.8.1.3电子包装材料 - 热界面材料 - 墨西哥
5.9电子包装材料焊球 - 北美
5.9.1电子包装材料焊球 - 北美,由地理位置
5.9.1.1 Electronic Packaging Material-Solder Balls-U.S.
5.9.1.2电子包装材料焊球 - 加拿大
5.9.1.3电子包装材料焊球 - 墨西哥
6 Electronic Packaging Material-North America, By Technologies
6.1 Split By Geography
6.3电子包装材料 - U.S。通过技术
6.1 Electronic Packaging Material-Canada by Technologies
6.1电子包装材料 - 墨西哥技术
6.2双线封装(DIP) - 北美洲
6.2.1双线封装(DIP) - 北美洲,由地理位置
6.2.1.1双线封装(DIP)-U.S。
6.2.1.2 Dual in-line package (DIP)-Canada
6.2.1.3 Dual in-line package (DIP)-Mexico
6.3小纲包装(SOP) - 北美洲
6.3.1 Small Outline Package (SOP)-North America, By Geographies
6.3.1.1小型大纲包(SOP)-U.S。
6.3.1.2小型轮廓包(SOP)-CANADA
6.3.1.3 Small Outline Package (SOP)-Mexico
6.4网格阵列(GA) - 北美洲
6.4.1 Grid Array (GA)-North America, By Geographies
6.4.1.1网格阵列(GA)-U.S。
6.4.1.2网格阵列(GA)-Canada
6.4.1.3 Grid Array (GA)-Mexico
6.5四平面无铅包(QFN) - 北美洲
6.5.1 Quad Flat No-leads package (QFN)-North America, By Geographies
6.5.1.1 Quad Flat No-leads package (QFN)-U.S.
6.5.1.2 Quad Flat No-leads package (QFN)-Canada
6.5.1.3 Quad Flat No-leads package (QFN)-Mexico
6.6双平没有铅包包(DFN) - 北美洲
6.6.1 Dual Flat No Lead Package (DFN)-North America, By Geographies
6.6.1.1 Dual Flat No Lead Package (DFN)-U.S.
6.6.1.2双平没有铅包(DFN)-Canada
6.6.1.3双平没有铅包包(DFN)-mexico
6.7四扁包装(QFP) - 北美洲
6.7.1 Quad Flat Package (QFP)-North America, By Geographies
6.7.1.1四扁包装(QFP)-U.S。
6.7.1.2 Quad Flat Package (QFP)-Canada
6.7.1.3 Quad Flat Package (QFP)-Mexico
7 Electronic Packaging Material-North America, By Geographies
7.1 Electronic Packaging Material-U.S.
7.1.1 Electronic Packaging Material-U.S., By Types
7.1.1.1电子包装材料 - 有机基材-U.S。
7.1.1.2 Electronic Packaging Material-Bonding Wires-U.S.
7.1.1.3 Electronic Packaging Material-Lead Frames-U.S.
7.1.1.4电子包装材料 - 封装树脂 - U.S。
7.1.1.5电子包装材料 - 陶瓷包装-U.S。
7.1.1.6电子包装材料模具附着材料 - U.S。
7.1.1.7 Electronic Packaging Material-Thermal Interface Materials-U.S.
7.1.1.8 Electronic Packaging Material-Solder Balls-U.S.
7.1.2电子包装材料-U.S。,通过应用
7.1.2.1电子包装材料 - U.S.-Small轮廓包(SOP)
7.1.2.2电子包装材料 - U.S.-Grid阵列(GA)
7.1.2.3 Electronic Packaging Material-U.S.-Quad Flat No-leads package (QFN)
7.1.2.4电子包装材料 - U.S.-四平面包(QFP)
7.1.2.5电子包装材料 - U.S.-Dual Flat No Lead Package(DFN)
7.1.2.6电子包装材料 - U.S.-Dual在线包装(DIP)
7.1.3 Electronic Packaging Material-U.S., By Technologies
7.1.3.1双线封装(DIP)-U.S。
7.1.3.2小纲包装(SOP)-U.S。
7.1.3.3 Grid Array (GA)-U.S.
7.1.3.4 Quad Flat No-leads package (QFN)-U.S.
7.1.3.5 Dual Flat No Lead Package (DFN)-U.S.
7.1.3.6四扁包装(QFP)-U.S。
7.2 Electronic Packaging Material-Canada
7.2.1电子包装材料 - 加拿大,按类型
7.2.1.1 Electronic Packaging Material-Organic Substrates-Canada
7.2.1.2 Electronic Packaging Material-Bonding Wires-Canada
7.2.1.3电子包装材料 - 引线框架 - 加拿大
7.2.1.4 Electronic Packaging Material-Encapsulation Resins-Canada
7.2.1.5 Electronic Packaging Material-Ceramic Packages-Canada
7.2.1.6 Electronic Packaging Material-Die Attach Materials-Canada
7.2.1.7电子包装材料 - 热界面材料 - 加拿大
7.2.1.8 Electronic Packaging Material-Solder Balls-Canada
7.2.2 Electronic Packaging Material-Canada, By Applications
7.2.2.1 Electronic Packaging Material-Canada-Small Outline Package (SOP)
7.2.2.2电子包装材料 - 加拿大 - 网格阵列(GA)
7.2.2.3 Electronic Packaging Material-Canada-Quad Flat No-leads package (QFN)
7.2.2.4 Electronic Packaging Material-Canada-Dual Flat No Lead Package (DFN)
7.2.2.5 Electronic Packaging Material-Canada-Quad Flat Package (QFP)
7.2.2.6 Electronic Packaging Material-Canada-Dual in-line package (DIP)
7.2.3电子包装材料 - 加拿大,通过技术
7.2.3.1双线封装(DIP)-CANADA
7.2.3.2小型大纲包(SOP)-CANADA
7.2.3.3 Grid Array (GA)-Canada
7.2.3.4 Quad Flat No-leads package (QFN)-Canada
7.2.3.5 Dual Flat No Lead Package (DFN)-Canada
7.2.3.6四扁包装(QFP)-Canada
7.3 Electronic Packaging Material-Mexico
7.3.1电子包装材质 - 墨西哥,按类型
7.3.1.1 Electronic Packaging Material-Organic Substrates-Mexico
7.3.1.2 Electronic Packaging Material-Bonding Wires-Mexico
7.3.1.3 Electronic Packaging Material-Lead Frames-Mexico
7.3.1.4 Electronic Packaging Material-Encapsulation Resins-Mexico
7.3.1.5电子包装材料 - 陶瓷包装 - 墨西哥
7.3.1.6 Electronic Packaging Material-Die Attach Materials-Mexico
7.3.1.7电子包装材料 - 热界面材料 - 墨西哥
7.3.1.8电子包装材料焊球 - 墨西哥
7.3.2电子包装材料 - 墨西哥,通过应用
7.3.2.1 Electronic Packaging Material-Mexico-Small Outline Package (SOP)
7.3.2.2电子封装Material-Mexico-GridArray (GA)
7.3.2.3电子包装材质 - 墨西哥 - 四边形无铅包装(QFN)
7.3.2.4 Electronic Packaging Material-Mexico-Dual Flat No Lead Package (DFN)
7.3.2.5电子包装材料 - 墨西哥 - 四边形包装(QFP)
7.3.2.6 Electronic Packaging Material-Mexico-Dual in-line package (DIP)
7.3.3 Electronic Packaging Material-Mexico, By Technologies
7.3.3.1 Dual in-line package (DIP)-Mexico
7.3.3.2小型轮廓包(SOP)-MEXICO
7.3.3.3 Grid Array (GA)-Mexico
7.3.3.4 Quad Flat No-leads package (QFN)-Mexico
7.3.3.5双平没有铅包(DFN)-mexico
7.3.3.6 Quad Flat Package (QFP)-Mexico
8电子包装材料 - 北美,由公司
8.1竞争风景
8.2 Split By Geography
8.4 Electronic Packaging Material-U.S. by Companies
8.1电子包装材料 - 加拿大由公司
8.1 Electronic Packaging Material-Mexico by Companies
8.3电子包装材料 - 北美 - 道德公司
8.4电子包装材料 - 北美 - 美国铟公司
8.5 Electronic Packaging Material-North America-Mitsui High-tec, Inc.
8.6电子包装材料 - 北美 - 日立化学公司

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北美电子包装材料Market

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